A Warp analysis is used to diagnose the cause of warping and recommend a solution, such as gate location changes, design parameter changes, or reduction of wall thickness variations.
Warp analysis is supported for Dual Domain and 3D analysis technologies.
Any attempt to predict the likelihood and amount of warpage for a particular component must first account for these shrinkage variations.
The material that is used influences the warpage of the part. Sometimes you must choose a material with low, uniform shrinkage to achieve dimensional accuracy. These materials are usually more expensive, but you may be able to use a cheaper material and save costs by observing shrinkage and warpage design principles.
The results of a Fiber Orientation analysis can be used as input for a Warp analysis to provide more detailed results and greater accuracy.
The following table summarizes the setup tasks required to prepare a Warp analysis.
|Setup task||Analysis technology|
|Selecting a material|
To run a warp analysis, you must include a Fill+Pack analysis.
Once the analysis has finished, the Summary pane appears.
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