A wire sweep analysis is used to predict the deformation of the bonding wires within the cavity.
A wire sweep analysis is run as part of the microchip encapsulation molding process. It is used to calculate the deformation of the bonding wires (connecting the chip to the leadframe) that occurs during encapsulation. This calculation enables you to improve the mold design and process conditions to prevent wire-sweep from occurring during encapsulation. The wire deformation can be calculated either internally in Autodesk Moldflow Insight using the Warp module or externally using Abaqus.