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Process controller for overmolding second component dialog-Time Control (Cool) tab
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Process controller for overmolding second component dialog-Time Control (Fill) tab
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Process controller for overmolding second component dialog-Time Control (Fill + Pack) tab
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Process Settings Wizard dialog-Controller A Settings
Mold surface temperature
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Switch to the other controller by
Controller A settings...
Fiber orientation analysis if fiber material
Process Settings Wizard dialog-Controller B Settings
Melt temperature
Switch to the other controller by
Controller B settings...
Controller A Settings dialog
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Injection-compression analysis
Injection-Compression Advanced Options dialog
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Compression press controller
Injection molding machine
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Compression Press Controller dialog
Press open distance
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Press compression force cap
Press compression speed vs distance (compression is along z-direction)
Close injection location after packing
Compression surface dialog
Cross-sectional shape
Frozen check for compression control
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Compression surface dialog-Mold Properties tab
Cavity/core side assignment
Mold material
Compression surface dialog-Mold Temperature Profile
Mold surface temperature controller: Top
Mold surface temperature controller: Bottom
Compression surface dialog-Eccentricity tab
Eccentricity (used only in warp and stress analyses)
Reactive Injection-compression Molding analysis types and analysis technologies
Reactive Molding analysis types
Process Settings Wizard dialog-RIM Settings
Mold surface temperature
Melt temperature
Nominal injection time
Melt initial conversion
Curing time
Machine pressure limit
Intensification ratio
Preconditioning analysis
Process Settings Wizard dialog-RIM-MIB Settings
Mold surface temperature
Melt temperature
Nominal injection time
Melt initial conversion
Machine pressure limit
Intensification ratio
Preconditioning analysis
Reactive Molding Advanced Options dialog
Molding material
Process controller
Compression press controller
Injection molding machine
Mold material
Solver parameters
Microchip Encapsulation analysis
Process Settings Wizard dialog-Microchip Encapsulation Settings
Mold surface temperature
Melt temperature
Nominal injection time
Melt initial conversion
Curing time
Machine pressure limit
Intensification ratio
Preconditioning analysis
Fiber orientation analysis if fiber material
Advanced options...
Leadframe dialog
Material from which this feature is made
Thickness
Microcellular Injection Molding analysis
Process Settings Wizard dialog-Microcellular Injection Molding Settings
Volume filled at start of foaming
Initial bubble radius
Number of cells per volume
Initial gas concentration
Resin Transfer Molding
Process Settings Wizard dialog-RTM/SRIM Settings
Mold surface temperature
Melt temperature
Nominal injection time
Melt initial conversion
Curing time
Machine pressure limit
Intensification ratio
Preconditioning analysis
Preform Surface (Dual Domain) dialog
Preform
Thickness
Dual Domain type
Preform orientation
Occurrence numbers
Preform Surface (Midplane) dialog
Preform
Preform orientation
Thickness
Occurrence numbers
Underfill Encapsulation analysis
Underfill Encapsulation analysis types and analysis technologies (Quick Reference)
Initial encapsulant temperature
Initial encapsulant conversion
Substrate temperature
Curing temperature
Curing time
Dynamic dispensing analysis
Advanced options...
Underfill Encapsulation Advanced Options dialog
Underfill encapsulant
Solver parameters
Family name
Trade name
Manufacturer
Family abbreviation
Data source
Date last modified
Data status
Fibers/fillers
Underfill Encapsulant dialog - Filler Properties
Filler data
Density (rho)
Specific heat (Cp)
Thermal conductivity (k)
Mechanical properties data
Coefficient of thermal expansion (CTE) data
Tensile strength data
Aspect ratio (L/D)
Filler length information
Underfill Encapsulant dialog - Reaction Kinetics Properties
N-th order kinetics
Underfill Encapsulant dialog - Recommended Processing
Initial encapsulant temperature
Initial encapsulant temperature range
Substrate temperature
Substrate temperature range
Underfill Encapsulant dialog - Rheological Properties
Default viscosity model
Underfill Encapsulant dialog - Surface Tension Properties
Dynamic surface tension model
Underfill Encapsulant dialog - Thermal Properties
Melt density
Solid density
Specific heat data
Thermal conductivity data
Dispensing controller dialog
Start node or end node of the pass
Dispensing controller - Name
Dispensing data dialog
Dispensing volume per pass
Start time / End time for each pass
Dispensing Location dialog
Underfill encapsulant
Underfill conditions
Solver parameters
Multiple-barrel Reactive Molding analysis types and analysis technologies
Analysis sequence
Materials and databases
Process settings
Optimization
Launching an analysis
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Compression surface dialog-Mold Properties tab

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    The Mold Properties tab of the Compression surface dialog is used to specify the properties of the mold blocks in contact with the selected elements or regions of type Compression surface.

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