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How to add your knowledge
Table of contents
No headersThis page of the Process Settings Wizard, which can be accessed by clicking 
(Home tab 
Molding Process Setup panel Process Settings), is used to specify the microchip encapsulation related process settings for the analysis sequence.
NoteSome of the items listed below may not be available on the current dialog. This is dependent on the mesh type, molding process and analysis sequence selected.
| The temperature of the mold at the plastic-metal interface, where the plastic touches the mold. | |
| The temperature of the molten plastic, or melt, as it starts to flow into the cavity. | |
| Enter the injection time that you would use with the injection unit for the process. | |
| Enter a value between -1 and 1 to specify the initial conversion (curing) level at the injection location. | |
| The time taken for a thermoset material to become sufficiently cross-linked from heating to form a solid and freeze. | |
| The maximum allowable hydraulic pressure that can be used on the injection molding machine. | |
| The ratio of the material pressure in front of the screw, compared to the oil pressure in the piston of the injection molding machine. | |
| Specifies the method by which the filling phase of the analysis is controlled. | |
| The criteria by which the molding machine will switch from velocity control to pressure control. | |
| Specifies the method by which the pressure phase of the molding process is controlled. | |
| Specifies whether a preconditioning analysis should be performed. | |
| Enables a Fiber orientation analysis if the material includes fiber. | |
| Displays the advanced options for the analysis. |
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| ac.menuaro.gif No description | 63 bytes | 13:08, 5 Jun 2012 | contentconnector | Actions | |
