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Simulation Moldflow

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Reactive Injection-compression Molding analysis types and analysis technologies
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Process Settings Wizard dialog-RIM Settings
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Microchip Encapsulation analysis
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Mold surface temperature
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Preform Surface (Dual Domain) dialog
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Preform Surface (Midplane) dialog
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Underfill Encapsulation analysis
Underfill Encapsulation analysis types and analysis technologies (Quick Reference)
Initial encapsulant temperature
Initial encapsulant conversion
Substrate temperature
Curing temperature
Curing time
Dynamic dispensing analysis
Advanced options...
Underfill Encapsulation Advanced Options dialog
Underfill encapsulant
Solver parameters
Family name
Trade name
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Family abbreviation
Data source
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Fibers/fillers
Underfill Encapsulant dialog - Filler Properties
Filler data
Density (rho)
Specific heat (Cp)
Thermal conductivity (k)
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Coefficient of thermal expansion (CTE) data
Tensile strength data
Aspect ratio (L/D)
Filler length information
Underfill Encapsulant dialog - Reaction Kinetics Properties
N-th order kinetics
Underfill Encapsulant dialog - Recommended Processing
Initial encapsulant temperature
Initial encapsulant temperature range
Substrate temperature
Substrate temperature range
Underfill Encapsulant dialog - Rheological Properties
Default viscosity model
Underfill Encapsulant dialog - Surface Tension Properties
Dynamic surface tension model
Underfill Encapsulant dialog - Thermal Properties
Melt density
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Dispensing controller dialog
Start node or end node of the pass
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Underfill encapsulant
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Initial encapsulant conversion

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    Specify the initial conversion (curing) level of the encapsulant before the start of the process.

    To specify the level of conversion, enter a value between -1 and 1 where:

    • -1 = beginning of induction period (where relevant)
    • 0 = the beginning of conversion
    • 1 = end of conversion

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