The Microchip Options tab of the Reactive Molding solver parameters (3D) dialog is used to specify values for analysis related inputs for a 3D Microchip Encapsulation analysis.
|This option is used to select the type of Stress analysis to run to predict paddle shift/wire sweep.|
|If the analysis sequence includes wire sweep and/or paddle shift simulation, this option is used to specify which solver will be used to perform this simulation.|
|This option is used to define a lower bound for the temperature value when calculating the viscosity of the material. When the predicted temperature of the melt is lower than the cut-off value, then the viscosity is calculated at this viscosity cut-off temperature.|
| When the selected analysis sequence includes Wire Sweep, this option is used to specify whether the analysis will account for the effects of wires on flow. |
|When the selected analysis sequence includes Wire Sweep, this option is used to define the distance between pairs of adjacent wires (after wire deformation) at which the wires are considered to be too close together. The clearance distance is measured between the surfaces of adjacent wires. |
|This option specifies whether the part insert and core temperatures are set to a fixed value, or calculated by the Fill+Pack analysis.|
To specify values for these options to be used in the current study, double-click in the Study Tasks pane, or click ( ) to open the Process Settings Wizard. Click to display the Profile Settings page; click ; click in the Solver parameters area; and click the Microchip Options tab.