The Microchip Options tab of the Reactive Molding solver parameters (3D) dialog is used to specify values for analysis related inputs for a 3D Microchip Encapsulation analysis.

Stress analysis type	This option is used to select the type of Stress analysis to run to predict paddle shift/wire sweep.
Perform wire sweep/paddle shift simulation in	If the analysis sequence includes wire sweep and/or paddle shift simulation, this option is used to specify which solver will be used to perform this simulation.
Viscosity cut-off temperature	This option is used to define a lower bound for the temperature value when calculating the viscosity of the material. When the predicted temperature of the melt is lower than the cut-off value, then the viscosity is calculated at this viscosity cut-off temperature. NoteThis option is specifically intended for 3D reactive analyses that exhibit convergence problems, typically for materials with a low melt temperature. These convergence problems may be able to be resolved by setting the viscosity cut-off temperature to somewhat higher than the melt temperature.
Effects of wires on flow	When the selected analysis sequence includes Wire Sweep, this option is used to specify whether the analysis will account for the effects of wires on flow. The default setting is Do not consider. Change the setting to Consider to include the effects of wires on flow and effects of adjacent wires on the drag force. NoteThis option is available only when the wire sweep calculation is performed in Autodesk Simulation Moldflow Insight. NoteThe Wire Sweep Detail analysis always includes the effects of wires on flow. Therefore, the Effects of wires on flow option setting has no effect on results when the analysis sequence includes Wire Sweep Detail.
Critical clearance between wires	When the selected analysis sequence includes Wire Sweep, this option is used to define the distance between pairs of adjacent wires (after wire deformation) at which the wires are considered to be too close together. The clearance distance is measured between the surfaces of adjacent wires. The default value is 0, which indicates that adjacent wires can touch. Specify a value greater than zero if you want more clearance between adjacent wires. NoteThis option is available only when the wire sweep calculation is performed in Autodesk Simulation Moldflow Insight.
Insert temperature	This option specifies whether the part insert and core temperatures are set to a fixed value, or calculated by the Fill+Pack analysis.

To specify values for these options to be used in the current study, double-click Process Settings in the Study Tasks pane, or click (Home tab Molding Process Setup panel Process Settings) to open the Process Settings Wizard. Click Next to display the Profile Settings page; click Advanced options; click Edit in the Solver parameters area; and click the Microchip Options tab.

To view or change default settings for these options, click (Tools tab Databases panel Edit Default Properties); from the Properties list, select Parameters, and then from the Description table, select Reactive Molding solver parameters defaults (3D); click Edit; and click the Microchip Options tab.

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Microchip Options tab dialog

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