- 360 Publisher
- Alias
- AutoCAD
- AutoCAD Civil 3D
- AutoCAD Electrical
- AutoCAD for Mac
- AutoCAD LT for Mac
- AutoCAD Map 3D
- BIM 360 Glue
- Building Design Suite
- Constructware
- Creative Finishing
- Design Review
- Factory Design Suite
- Flame Premium
- Green Building Studio
- Infr. Map Server
- Infrastructure Modeler
- Installation Help
- Inventor
- Inventor ETO
- Inventor Fusion
- Inventor Fusion Technology for Mac
- Inventor LT
- Inventor Publisher
- Navisworks
- Navisworks Freedom
- PLM 360
- Product Design Suite
- Project Galileo
- Project Photofly
- Project Simulus
- Revit
- Revit LT
- Robot Structural Analysis Professional
- Sim 360 Pro and Sim 360 Moldflow
- Simulation 360
- Simulation CFD
- Simulation DFM
- Simulation Job Manager
- Simulation Mechanical
- Simulation Moldflow
- Simulation Moldflow Adviser
- Simulation Moldflow Communicator
- Simulation Moldflow Insight
- Simulation Moldflow Insight 360
- Smoke
- Vasari
- Vault
Table of contents
Graphical results
The following table lists the graphical results that are created by a Microchip Encapsulation analysis and indicates whether each result is supported for the following analysis technologies:
Midplane 
Dual Domain 
3D
A Microchip Encapsulation analysis generates the filling, curing, and stress results listed in the table below. For more information about a result, including how to interpret the display, click on the result name.
Click 
, then click Options 
Results tab and in the Optimize memory for results display area, click in the checkbox to enable this option.
| Warp results | Analysis technology |
|---|---|
| Deflection, all effects2 | |
Topics in this section
- Deflection, in-plane (wire sweep) result
The Deflection, in-plane (wire sweep) result displays the predicted X-Y (in-plane) deformation of the wire resulting from the encapsulation process.
- Microchip Encapsulation analysis log
The Microchip Encapsulation analysis log is a text report that lists the inputs that you used for the analysis, including solver parameters, material data, process settings an model details, followed by the analysis progress tables.
- Pressure difference (paddle shift) result
The Pressure difference result shows you the difference in pressure, over time, between the upper and lower cavities separated by the leadframe.
- Pressure difference, maximum (paddle shift) result
The Pressure difference, maximum (paddle shift) result shows you the maximum difference in pressure, over time, between the upper and lower cavities separated by the leadframe.
- Wire-sweep index result
The Wire-sweep index result is a representation of the force created by the flow of plastic past the wires of an integrated circuit.
- XY deflection (wire sweep) result
The XY deflection (wire sweep) result displays the predicted X-Y (in-plane) deformation of the wire resulting from the encapsulation process.
- Wire number result
The Wire number result graphically shows the identification number assigned to each wire.
- Maximum wire deflection magnitude - Wire number: XY Plot result
The Maximum wire deflection magnitude - Wire number: XY Plot result shows the maximum deflection value of each wire in the model.
- Maximum wire sweep index - Wire number: XY Plot result
The Maximum wire sweep index - Wire number: XY Plot result shows the maximum wire sweep index value of each wire in the model.
- Wire pairs within critical clearance result
The Wire pairs within critical clearance result shows number of wire pairs for which the predicted clearance after wire deformation is equal to or less than the specified critical clearance value.
- Distance to closest wire result
The Distance to closest wire result shows, for each wire, the distance to the nearest other wire in the model.
Comments0
Attach FilesFiles1
| File | Size | Date | Attached by | |||
|---|---|---|---|---|---|---|
| ac.menuaro.gif No description | 63 bytes | 17:04, 5 Jun 2012 | contentconnector | Actions | |
