The analysis sequence is the predefined sequence of analyses that you want to run.
The analysis sequences that are available depend on the analysis technology or the mesh type that is used, and the molding process that you have selected.
Analysis sequence icons are displayed in the Study Tasks pane.
The use of an appropriate analysis technology helps to ensure that analysis results are accurate.
The analysis technologies that are available to you depend on the analysis type that you select. This table lists the available analysis technologies for a given analysis type.
A Design Adviser analysis shows areas in the part that are likely to cause problems during other analyses.
The Gate Location analysis is used to recommend injection locations for the part. This analysis works for all analysis technologies and is used as a preliminary input for a full Fill+Pack analysis.
The Molding Window analysis is used to calculate the best preliminary process settings for your study.
The Fill analysis predicts the thermoplastic polymer flow inside the mold in the filling phase. This analysis is often run as the first part of a Fill+Pack analysis sequence.
The Cooling Quality Analysis provides basic cooling information and identifies areas in the part that are not being cooled effectively.
The Sink Mark analysis shows the location and severity of sink marks that are likely to affect part quality.
The Runner Adviser Analysis is used to calculate the best runner, gate, and sprue dimensions to achieve minimal pressure drop and ensure that the part fills.
The Runner Balance Analysis is used to determine the optimum volume for the sections of the runner system. This analysis ensures that the part fills evenly and there is an acceptable pressure magnitude in the cavity, minimizing runner volume.
The Pack Analysis predicts the thermoplastic polymer flow inside the mold during the packing phase. This analysis is run as the second stage of a Fill+Pack analysis sequence, and can be used to determine whether a cavity will be completely filled.
A Warp analysis is used to diagnose the cause of warping and recommend a solution, such as gate location changes, design parameter changes, or reduction of wall thickness variations.