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Table of contents
This help topic provides an overview of the results generated by a Microchip Encapsulation analysis.
Graphical results
The following table lists the graphical results that are created by a Microchip Encapsulation analysis and indicates whether each result is supported for the following analysis technologies:
Midplane 
Dual Domain 
3D
A Microchip Encapsulation analysis generates the filling, curing, and stress results listed in the table below. For more information about a result, including how to interpret the display, click on the result name.
Click , then click Options 
Results tab and in the Optimize memory for results display area, click in the checkbox to enable this option.
| Warp results | Analysis technology |
|---|---|
| Deflection, all effects2 | |
Topics in this section
- Deflection, in-plane (wire sweep) result
The Deflection, in-plane (wire sweep) result displays the predicted X-Y (in-plane) deformation of the wire resulting from the encapsulation process.
- Distance to closest wire result
The Distance to closest wire result shows, for each wire, the distance to the nearest other wire in the model.
- Maximum wire deflection magnitude - Wire number: XY Plot result
The Maximum wire deflection magnitude - Wire number: XY Plot result shows the maximum deflection value of each wire in the model.
- Maximum wire sweep index - Wire number: XY Plot result
The Maximum wire sweep index - Wire number: XY Plot result shows the maximum wire sweep index value of each wire in the model.
- Microchip Encapsulation analysis log
The Microchip Encapsulation analysis log is a text report that lists the inputs that you used for the analysis, including solver parameters, material data, process settings an model details, followed by the analysis progress tables.
- Pressure difference (paddle shift) result
The Pressure difference result shows you the difference in pressure, over time, between the upper and lower cavities separated by the leadframe.
- Pressure difference, maximum (paddle shift) result
The Pressure difference, maximum (paddle shift) result shows you the maximum difference in pressure, over time, between the upper and lower cavities separated by the leadframe.
- Wire number result
The Wire number result graphically shows the identification number assigned to each wire.
- Wire pairs within critical clearance result
The Wire pairs within critical clearance result shows number of wire pairs for which the predicted clearance after wire deformation is equal to or less than the specified critical clearance value.
- Wire-sweep index result
The Wire-sweep index result is a representation of the force created by the flow of plastic past the wires of an integrated circuit.
- XY deflection (wire sweep) result
The XY deflection (wire sweep) result displays the predicted X-Y (in-plane) deformation of the wire resulting from the encapsulation process.
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