The Rapid heating and cooling circuit pressure number result shows the pressure of the fluid in the heating and cooling circuit at any given time, for both dual domain and 3D analyses. This result is generated from a rapid mold heating and cooling simulation using a Transient Cool analysis.
The Rapid heating and cooling circuit pressure number result is best used in conjunction with the data in the analysis log. The analysis log indicates when the program transitions to the next step and thereby helps you understand what is happening when looking at the circuit pressure result. The magnitude of the pressure depends on the stage of the rapid mold heating and cooling cycle.
The Rapid heating and cooling circuit pressure number result can be divided into the four different periods of the simulation; the primary air purge, when coolant is flowing through the lines, the secondary air purge, and while the circuit is being heated. In most cases, when coolant is flowing, the pressure will be at its lowest. The pressure rises slightly when the circuit is being purged during both the primary and secondary air purges. In most cases, the pressure will be at its highest when the circuit is steam heated.