The Temperature, mold-circuit interface (averaged) result is an elemental result averaged over the cycle, and shows the temperature of the metal cooling circuits, calculated using the finite element method (FEM).
The temperature distribution should be evenly distributed on the cooling circuits. The temperature will increase where the circuit nears the part, and these hotter regions will also heat the coolant. The temperature should be no more than 5°C greater than the inlet temperature.
If the circuit temperature is too hot in these areas, consider the following resolutions: