The Bulk temperature, nodal result is created when running a Reactive Molding Fill analysis or a Microchip Encapsulation Fill analysis.
It is used to indicate the weighted average temperature across the part thickness. It is a velocity-weighted average temperature when the polymer is flowing and a simple average temperature when the flow stops.
Using this result
Bulk temperature displays are an alternate way to examine the flow distribution. Areas with continuous flow (heat convection) typically have a higher bulk temperature. The bulk temperature drops quickly when the flow stops in that area.
Hot spots are indicated on the bulk-temperature contour or data-shaded plots during filling. Hot spots are due to excessive viscous heating during the filling stage.
If the maximum bulk temperature is close to the degradation temperature, then consider redesigning the part geometry near the hot spot or changing the process conditions.
Changes such as those above can only be made using a licensed Autodesk Simulation Moldflow Adviser or Autodesk Simulation Moldflow Insight
Things to look for
- Uniform bulk temperature distribution during filling is desirable for mold design.