The Stress, Mises-Hencky result shows the Mises-Hencky stress (maximum normal stress) in the part (Warp or Stress analysis), or in the wire or paddle (Microchip Encapsulation analysis), at the selected layer through the cross-section, in the deformed state after ejection has occurred.
Use this result when the material is ductile. Consider the areas with a high level of stress and compare the results against the relevant material criteria.
Note that the plot corresponds to one particular position through the cross-section, as specified by a normalized thickness value where -1 is the bottom of the element, 0 is the centerline through the element, and +1 is the top of the element.