The deflection result shows the deflection at each node of the part ( Warp or Stress analysis), or each node of the wire or paddle ( Microchip Encapsulation analysis).
It is based on a best fit technique, where the original geometry and the deformed geometry are overlayed in such a way that they best fit together, or based on a defined anchor plane.
There are a number of possible variants of the deflection result according to paddle (Microchip Encapsulation analysis), based on a best fit:
- Analysis type
The result name may indicate the type of analysis that was run, that is, either small deflection or large deflection. If this is not indicated in the result name, then the results will apply to a small deflection analysis.
- Net vs component deflections
You can view the net deflections at each node, or the component of the deflection along either the X, Y or Z axis. The axis directions are determined by the defined anchor plane and are indicated in the anchor plane symbols.
- All effects vs warpage contributors
There are four sets of deflection results.
- All effects
The total deflection at each node.
- Differential shrinkage
The component of the total deflection (warpage) at each node attributable to differential shrinkage.
- Orientation effects
The component of the total deflection (warpage) at each node attributable to orientation.
- Differential cooling
The component of the total deflection (warpage) at each node attributable to differential cooling.
- Corner effects
The component of the total deflection (warpage) at each node attributable to corner effects.
Using this result
The net deflection plot shows you the total predicted deformation of the part, based on the default best fit technique, as explained above, or the defined anchor plane.
The tool is particularly useful for deflection plots as it shows the coordinates of selected nodes before and after deformation and the distance between two successively selected nodes, also before and after deformation.
A warp analysis with the option activated outputs not only the total deflection results but also breaks down the total deflections according to defined contributors to warpage: differential shrinkage, orientation effects and differential cooling. Midplane and Dual Domain analyses can also display warpage due to corner effects. The contributor with the largest deflection values can be regarded as the dominant cause of warpage. Having identified the dominant cause of warpage, specific measures can then be taken to attempt to reduce the overall warpage based on the particular cause.
Adjustments such as those above can only be made using a licensed Autodesk Simulation Moldflow Adviser or Autodesk Simulation Moldflow Insight