The Cool analyses are heat transfer analysis products designed to analyze flow of heat in plastic injection molds. The principle goals of these analyses are to determine temperatures in the plastic filled cavity and throughout the mold, and to determine the cooling time.
In addition to these primary results, cooling network flow parameters, such as pressure or flow rate requirements, are also produced. Network analysis also provides information on pumping requirements for a given circuit and coolant combination.
A feature of the Cool analysis products is that they interface to the Fill+Pack analyses. This enables the Fill+Pack analysis to recognize the effects of local hot and cold spots arising from a given cooling situation. Warp, in turn, considers the cooling effects carried onto the Fill+Pack analysis in order to compute the impact of differential temperature distributions on part warpage.