Different materials can be used to attach a die to the pins on the leadframe. Traditionally the wires were gold.
The final step in semiconductor device fabrication is the packaging of the chips. This process, also known as microchip encapsulation, involves mounting the integrated circuit or die on the leadframe, connecting the die pads to the pins with wire, and sealing the die. This final step can be simulated and the effect on the wire assessed.
You can study the properties of a material before you select it, to ensure it is appropriate for your analysis.
This dialog provides you with the opportunity to study the properties of the wire material you have selected.