Predicting how a molten material flows in a mold, can be very complex. There are several models that have been developed to help with this prediction, which vary in the dependencies they consider and the molding process they address.
You can select the most appropriate model from several different viscosity models. Parameters for simulation models can be adjusted.
The modified 2-domain Tait pvT model is used to determine the density of the material as a function of the temperature and pressure. This variation impacts on many aspects of the flow simulation.
The Cross-WLF viscosity model describes the temperature, shear rate, and pressure dependency of the viscosity.
The extension viscosity model describes the dependence of the viscosity on the shear rate, temperature, pressure, and extension rate in 3D flow. The extension viscosity coefficients are determined by using the shear viscosity model and experimental pressure measurements in convergent flow.
The Herschel-Bulkley-WLF viscosity model can be used for thermoset materials that show a yield stress. This model can be used in a Reactive Molding, Microchip Encapsulation, or Underfill Encapsulation analysis.
A large pressure drop is often observed when the melt passes through contractions in the feed system, such as between the sprue, runners and gates, at the entrance of the die. Typically 85% of the pressure loss occurs at the entrance of the die, and 15% at the exit.
The matrix viscosity model is used to determine the viscosity from measured data supplied at specific temperatures, shear rates, and pressures.
The Moldflow second order viscosity model describes the temperature and shear rate dependence of the viscosity using a quadratic formulation.
The underfill viscosity model, which is a modification of the Herschel-Bulkley-WLF viscosity model for reactive materials, is used specifically for underfill encapsulants.
The dissolution of gas into the polymer melt will impact on the viscosity model used for Microcellular injection molding.
The reactive viscosity model describes the temperature, shear rate, and cure dependance of thermoset materials. This model can be used in a Reactive Molding, Microchip Encapsulation, or Underfill Encapsulation analysis.
The n-th order reaction kinetics (Kamal model) is used to calculate the curing behavior of a thermoset material in a Reactive Molding, Microchip Encapsulation, or Underfill Encapsulation analysis.
The Mori-Tanaka micro-mechanics model uses anisotropic matrix material properties to calculate mechanical properties of fiber filled composite materials, improving the prediction of shrinkage and warpage.
Both the porosity and the permeability of the fiber-mat affect the filling pattern in a Reactive Molding analysis.
Surface tension data is required to analyze this dispensing process in underfill encapsulation.
The viscosity, flow rate, and Reynolds number of a coolant are interrelated.
The gas that was dissolved in the polymer melt in the initial step of the Microcellular injection molding process will diffuse out of the melt in the foaming stage, nucleating and growing bubbles in the process.
The solubility of gas into the polymer melt can affect both the viscosity of the melt and the bubble size in the finished product.