The Distance to closest wire result shows, for each wire, the distance to the nearest other wire in the model.
The Distance to closest wire result is generated by a 3D Microchip Encapsulation analysis when the selected analysis sequence includes Wire Sweep.
The plot shows the location of individual wires with the distance to the closest other wire, after wire deformation has occurred during cavity filling.
Using this result
Ideally, wire spacing should be uniform. Use this information to identify wires that are too close or too far from adjacent wires.
In order to calculate the Distance to closest wire
result, the wire sweep calculation must be performed in Autodesk Simulation Moldflow Insight
This option is set on the Microchip Options
tab of the Reactive Molding solver parameters (3D)
in the Study Tasks pane, or click
( ) to open the Process Settings Wizard
. Click to display the Profile Settings
page; click ; click in the Solver parameters
area; and click the Microchip Options
tab. Set the option to Autodesk Simulation Moldflow Insight