The Distance to closest wire result shows, for each wire, the distance to the nearest other wire in the model.
The Distance to closest wire result is generated by a 3D Microchip Encapsulation analysis when the selected analysis sequence includes Wire Sweep.
The plot shows the location of individual wires with the distance to the closest other wire, after wire deformation has occurred during cavity filling.
Using this result
Ideally, wire spacing should be uniform. Use this information to identify wires that are too close or too far from adjacent wires.
NoteIn order to calculate the
Distance to closest wire result, the wire sweep calculation must be performed in
Autodesk Simulation Moldflow Insight.
TipThis option is set on the
Microchip Options tab of the
Reactive Molding solver parameters (3D) dialog. Double-click

in the Study Tasks pane, or click

() to open the
Process Settings Wizard. Click to display the
Profile Settings page; click ; click in the
Solver parameters area; and click the
Microchip Options tab. Set the option to
Autodesk Simulation Moldflow Insight.