The Stress in second principal direction result shows the second principal stress in the part (Warp or Stress analysis), or in the wire or paddle (Microchip Encapsulation analysis), at the selected layer through the cross-section, after ejection.
Consider the second principal stress when the material is brittle. Consider the areas with a high level of stress and compare the results against the relevant material criteria. If the absolute value of the second principal stress of an element is greater than the relevant material criteria then the part will fail.
Note that the plot corresponds to one particular position through the cross-section, as specified by a normalized thickness value where -1 is the bottom of the element, 0 is the centerline through the element, and +1 is the top of the element.