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The design engineer has two main concerns when cooling a mold:
- The mold is essentially a heat exchanger that must be capable of extracting heat at the required rate.
- The part must cool uniformly, in order to ensure a high quality product with minimum distortion.
The two factors, adequate heat extraction and uniform cooling of the mold, form the basis of the Cool analysis design philosophy.
In addition to these primary results, cooling network flow parameters, such as pressure or flow rate requirements, are also produced. Network analysis also provides information on pumping requirements for a given circuit and coolant combination.
A feature of the Cool analysis products is that they interface to the Fill+Pack analyses. This enables the Fill+Pack analysis to recognize the effects of local hot and cold spots arising from a given cooling situation. Warp, in turn, considers the cooling effects carried onto the Fill+Pack analysis in order to compute the impact of differential temperature distributions on part warpage.
Cool analysis results are based on the assumption that the model is initially filled with material at the melt temperature.
Temperatures can be used to understand the effectiveness of:
- Cooling channel location.
- Coolant inlet temperature.
- Coolant flow parameters.
- Mold inserts.
- Mold parting planes.
- Mold external surfaces.
- Part design on uniformity of part cooling.
- Mold temperature distributions.
- Cycle time.