Product help with community knowledge

# Simulation models

1. 1. Topics in this section

#### Topics in this section

• Simulation models (Procedure)

You can select the most appropriate model from several different viscosity models. Parameters for simulation models can be adjusted.

• 2-domain Tait pvT model

The modified 2-domain Tait pvT model is used to determine the density of the material as a function of the temperature and pressure. This variation impacts on many aspects of the flow simulation.

• Cross-WLF viscosity model

The Cross-WLF viscosity model describes the temperature, shear rate, and pressure dependency of the viscosity.

• Extension viscosity model

The extension viscosity model describes the dependence of the viscosity on the shear rate, temperature, pressure, and extension rate in 3D flow. The extension viscosity coefficients are determined by using the shear viscosity model and experimental pressure measurements in convergent flow.

• Herschel-Bulkley-WLF viscosity model

The Herschel-Bulkley-WLF viscosity model can be used for thermoset materials that show a yield stress. This model can be used in a Reactive Molding, Microchip Encapsulation, or Underfill Encapsulation analysis.

• Juncture loss model

A large pressure drop is often observed when the melt passes through contractions in the feed system, such as between the sprue, runners and gates, at the entrance of the die. Typically 85% of the pressure loss occurs at the entrance of the die, and 15% at the exit.

• Matrix viscosity model

The matrix viscosity model is used to determine the viscosity from measured data supplied at specific temperatures, shear rates, and pressures.

• Moldflow second order viscosity model

The Moldflow second order viscosity model describes the temperature and shear rate dependence of the viscosity using a quadratic formulation.

• Viscosity model for underfill encapsulation

The underfill viscosity model, which is a modification of the Herschel-Bulkley-WLF viscosity model for reactive materials, is used specifically for underfill encapsulants.

• Viscosity model for Microcellular injection molding

The dissolution of gas into the polymer melt will impact on the viscosity model used for Microcellular injection molding.

• Reactive viscosity model

The reactive viscosity model describes the temperature, shear rate, and cure dependance of thermoset materials. This model can be used in a Reactive Molding, Microchip Encapsulation, or Underfill Encapsulation analysis.

• N-th Order Kinetics model

The n-th order reaction kinetics (Kamal model) is used to calculate the curing behavior of a thermoset material in a Reactive Molding, Microchip Encapsulation, or Underfill Encapsulation analysis.

• Mori-Tanaka micro-mechanics model

The Mori-Tanaka micro-mechanics model uses anisotropic matrix material properties to calculate mechanical properties of fiber filled composite materials, improving the prediction of shrinkage and warpage.

• Preform porosity and permeability model

Both the porosity and the permeability of the fiber-mat affect the filling pattern in a Reactive Molding analysis.

• Dynamic surface tension model

Surface tension data is required to analyze this dispensing process in underfill encapsulation.

• Coolant viscosity model

The viscosity, flow rate, and Reynolds number of a coolant are interrelated.

• Gas diffusion model for Microcellular injection molding

The gas that was dissolved in the polymer melt in the initial step of the Microcellular injection molding process will diffuse out of the melt in the foaming stage, nucleating and growing bubbles in the process.

• Gas solubility model for Microcellular injection molding

The solubility of gas into the polymer melt can affect both the viscosity of the melt and the bubble size in the finished product.