Simulation Moldflow

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Viscosity model for underfill encapsulation

    Table of contents
    1. 1. Topics in this section

    The underfill viscosity model includes an additional term, (thickness), as described below:

    where

    • is the viscosity (Pa. sec.)
    • is the cavity thickness (meter)
    • is the viscosity at a reference thickness , and
    • and are data-fitted coefficients.

    The viscosity at the reference thickness can be obtained from the following equation:

    where

    • is the viscosity (Pa s)

    • is the shear rate (1/s)

    • is the temperature (K)
    • is the degree of cure (0–1), and
    • , , , , , , , and (gelation conversion) are data-fitted coefficients.
    Note For general thermoset materials, use either the Herschel-Bulkley-WLF viscosity model or the reactive viscosity model.