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Simulation Moldflow

2012
2013
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Co-injection analysis results
Object Missing
Average temperature, cold runner result
Average temperature, part result
Circuit coolant temperature result
Circuit flow rate result
Circuit metal temperature result
Circuit Reynolds number result
Cool analysis log
Circuit heat removal efficiency result
Circuit heat flux
Circuit pressure result
Criteria for assessing cooling performance
Flow front temperature, mold-cavity result
Flux, part (top) result
Flux, part (bottom) result
Flux, part result
Frozen layer percentage, part (bottom) result
Frozen layer percentage, part (top) result
Improper part-mold contact
Maximum temperature position, part result
Mold-melt temperature difference (bottom), part result
Mold-melt temperature difference (top), part result
Mold-melt temperature difference result
Mold parting surface result
Percentage frozen layer, cold runner result
Percentage frozen layer result
Percentage molten layer result
Rapid heating and cooling circuit density result
Rapid heating and cooling circuit flow rate result
Rapid heating and cooling circuit pressure result
Rapid heating and cooling circuit Reynolds number result
Steam condensate mass result
Steam quality result
Temperature at surface, cold runner result
Temperature at surface, hot runner result
Temperature, circuit coolant (averaged) result
Temperature, circuit coolant (transient) result
Temperature, circuit coolant (transient from start-up) result
Temperature, core (averaged) result
Temperature, core (transient) result
Temperature, core (transient from start-up) result
Temperature difference, insert result
Temperature difference, part result
Temperature difference, parting plane result
Temperature, insert (bottom) result
Temperature, insert (top) result
Temperature, internal mold result
Temperature, maximum, cold runner
Temperature, maximum, part result
Temperature, mold (bottom) result
Temperature, mold (top) result
Temperature, mold (averaged) result
Temperature, mold (transient) result
Temperature, mold (transient from start-up) result
Temperature, mold boundary result
Temperature, mold-cavity interface (averaged) result
Temperature, mold-cavity interface (transient) result
Temperature, mold-cavity interface (transient from start-up) result
Temperature, mold-circuit interface (averaged) result
Temperature, mold-circuit interface (transient) result
Temperature, mold-circuit interface (transient from start-up) result
Temperature, mold result
Temperature, mold insert (averaged) result
Temperature, mold insert (transient) result
Temperature, mold insert (transient from start-up) result
Temperature, mold-insert difference (averaged) result
Temperature, mold-insert difference (transient) result
Temperature, mold-insert difference (transient from start-up) result
Temperature, mold-mold difference (averaged) result
Temperature, mold-mold difference (transient) result
Temperature, mold-mold difference (transient from start-up) result
Temperature, part result
Temperature, part (bottom) result
Temperature, part (top) result
Temperature, part (averaged) result
Temperature, part (average, profile)
Temperature, part (transient) result
Temperature, part (transient, profile) result
Temperature, part (transient from start-up) result
Temperature, part (transient from start-up, profile) result
Temperature, part insert result
Temperature, part insert (averaged) result
Temperature, part insert (transient) result
Temperature, part insert (transient from start-up) result
Temperature, parting plane (bottom) result
Temperature, parting plane (top) result
Temperature profile, cold runner result
Temperature profile, hot runner result
Temperature profile, part result
Temperature, rapid heating and cooling thermocouples (transient from start-up) result
Temperature, rapid heating and cooling thermocouples (transient) result
Temperature residual, exterior shell result
Temperature residual, inserts result
Temperature residual, part result
Temperature, runner (averaged) result
Temperature, runner (average, profile) result
Temperature, runner (transient) result
Temperature, runner (transient, profile) result
Temperature, runner (transient from start-up) result
Temperature, runner (transient from start-up, profile) result
Time to reach ejection temperature, cold runner result
Time to reach ejection temperature, part result
Time to reach ejection temperature, part (profile) result
Fiber Orientation analysis results
Flow results
Gas-assisted Fill+Pack analysis results
Gate Location analysis results
Injection-compression analysis results
Microcellular Injection Molding analysis results
Microchip Encapsulation analysis results
Molding Window analysis results
Optimization product results
Process Optimization analysis results
Reactive Molding analysis results
Runner Balance analysis results
Shrink analysis results
Stress analysis results
Underfill Encapsulation analysis results
Warp analysis results
Birefringence analysis results
Crystallization analysis results
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770 views,  1 edit(s),  1947 characters(s) Page last modified 16:58, 5 Jun 2012 by contentconnector
How to add your knowledge

Circuit pressure result

    Using this result

    The pressure inside the cooling circuits should remain evenly distributed from the inlet circuit pressure to the outlet circuit pressure. Large pressure drops in the cooling circuits are caused by cooling problems, such as the bubbler or the baffle dimensions being too small.

    This result can be checked to determine the flow direction in parallel cooling circuits. The pressure will be highest at the coolant inlet and lowest at the coolant outlet.

    NoteThis result does not take into account the pressure loss due to external cooling lines, fittings, and so forth.

    Things to look for

    When viewing the Circuit pressure result, check the following:

    • Large pressure drops (inlet−outlet pressure).

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