It shows the difference in temperature between the part side and mold side of the part/mold interface on the top side of the part. The top side is defined by the orientation of the mesh elements.
The difference in temperature is determined by the .
A lower HTC value represents a greater resistance to heat transfer between the polymer and the mold.
Uneven part temperatures may result in warpage as the part cools after ejection. This may be because the mold surface is not conducting sufficient heat during molding.
To compensate for low mold conductivity, it may be necessary to add or alter cooling circuits to draw the extra heat away.