The heat transfer coefficent (HTC) is used during the cooling analysis. As a result, the mold side of the part/mold interface will be slightly cooler than the part side of the interface.
Use this result to find localized hot or cold spots, and determine whether they will affect cycle time and part warpage. If there are hot or cool spots, you may need to adjust the cooling channels, or coolant temperature.
The minimum and maximum mold temperature should be within 10°C of the target temperature for amorphous materials and within 5ºC for semi-crystalline materials. This guideline may be difficult to achieve for most molds, but should be the target of the Cool analysis. The narrower the temperature variation over the mold face, the less likely the mold temperature variation will contribute to warpage and an extended cycle time.
The Temperature, mold (top) result will typically be between 10ºC and 30ºC above the coolant inlet temperature. Cooling channel placement and the thermal conductivity of the mold will affect the temperature variations. If an automatic Injection + Packing + Cooling time is used, a coolant temperature very close to the target temperature will significantly extend the predicted cycle time.