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Simulation Moldflow

2012
2013
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Co-injection analysis results
Object Missing
Average temperature, cold runner result
Average temperature, part result
Circuit coolant temperature result
Circuit flow rate result
Circuit metal temperature result
Circuit Reynolds number result
Cool analysis log
Circuit heat removal efficiency result
Circuit heat flux
Circuit pressure result
Criteria for assessing cooling performance
Flow front temperature, mold-cavity result
Flux, part (top) result
Flux, part (bottom) result
Flux, part result
Frozen layer percentage, part (bottom) result
Frozen layer percentage, part (top) result
Improper part-mold contact
Maximum temperature position, part result
Mold-melt temperature difference (bottom), part result
Mold-melt temperature difference (top), part result
Mold-melt temperature difference result
Mold parting surface result
Percentage frozen layer, cold runner result
Percentage frozen layer result
Percentage molten layer result
Rapid heating and cooling circuit density result
Rapid heating and cooling circuit flow rate result
Rapid heating and cooling circuit pressure result
Rapid heating and cooling circuit Reynolds number result
Steam condensate mass result
Steam quality result
Temperature at surface, cold runner result
Temperature at surface, hot runner result
Temperature, circuit coolant (averaged) result
Temperature, circuit coolant (transient) result
Temperature, circuit coolant (transient from start-up) result
Temperature, core (averaged) result
Temperature, core (transient) result
Temperature, core (transient from start-up) result
Temperature difference, insert result
Temperature difference, part result
Temperature difference, parting plane result
Temperature, insert (bottom) result
Temperature, insert (top) result
Temperature, internal mold result
Temperature, maximum, cold runner
Temperature, maximum, part result
Temperature, mold (bottom) result
Temperature, mold (top) result
Temperature, mold (averaged) result
Temperature, mold (transient) result
Temperature, mold (transient from start-up) result
Temperature, mold boundary result
Temperature, mold-cavity interface (averaged) result
Temperature, mold-cavity interface (transient) result
Temperature, mold-cavity interface (transient from start-up) result
Temperature, mold-circuit interface (averaged) result
Temperature, mold-circuit interface (transient) result
Temperature, mold-circuit interface (transient from start-up) result
Temperature, mold result
Temperature, mold insert (averaged) result
Temperature, mold insert (transient) result
Temperature, mold insert (transient from start-up) result
Temperature, mold-insert difference (averaged) result
Temperature, mold-insert difference (transient) result
Temperature, mold-insert difference (transient from start-up) result
Temperature, mold-mold difference (averaged) result
Temperature, mold-mold difference (transient) result
Temperature, mold-mold difference (transient from start-up) result
Temperature, part result
Temperature, part (bottom) result
Temperature, part (top) result
Temperature, part (averaged) result
Temperature, part (average, profile)
Temperature, part (transient) result
Temperature, part (transient, profile) result
Temperature, part (transient from start-up) result
Temperature, part (transient from start-up, profile) result
Temperature, part insert result
Temperature, part insert (averaged) result
Temperature, part insert (transient) result
Temperature, part insert (transient from start-up) result
Temperature, parting plane (bottom) result
Temperature, parting plane (top) result
Temperature profile, cold runner result
Temperature profile, hot runner result
Temperature profile, part result
Temperature, rapid heating and cooling thermocouples (transient from start-up) result
Temperature, rapid heating and cooling thermocouples (transient) result
Temperature residual, exterior shell result
Temperature residual, inserts result
Temperature residual, part result
Temperature, runner (averaged) result
Temperature, runner (average, profile) result
Temperature, runner (transient) result
Temperature, runner (transient, profile) result
Temperature, runner (transient from start-up) result
Temperature, runner (transient from start-up, profile) result
Time to reach ejection temperature, cold runner result
Time to reach ejection temperature, part result
Time to reach ejection temperature, part (profile) result
Fiber Orientation analysis results
Flow results
Gas-assisted Fill+Pack analysis results
Gate Location analysis results
Injection-compression analysis results
Microcellular Injection Molding analysis results
Microchip Encapsulation analysis results
Molding Window analysis results
Optimization product results
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Runner Balance analysis results
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766 views,  1 edit(s),  1773 characters(s) Page last modified 16:59, 5 Jun 2012 by contentconnector
How to add your knowledge

Temperature, mold boundary result

    Using this result

    During the Cool analysis, it is assumed that the outside air temperature is 25°C. Therefore, the mold boundary temperature should be evenly distributed. If the mold boundary temperature is not even, then you may need to make the mold bigger or smaller. If the mold boundary result is showing hot regions, then you may need to add more cooling circuits to your design.

    Note The Mold Block Surface layer must be selected in the Layers pane in order to view this result or add this result to an Moldflow Results file (*.mfr).

    Things to look for

    • Evenly distributed temperatures
    • Hot spots-try to acheive more uniform cooling

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