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Simulation Moldflow

2012
2013
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Co-injection analysis results
Object Missing
Average temperature, cold runner result
Average temperature, part result
Circuit coolant temperature result
Circuit flow rate result
Circuit metal temperature result
Circuit Reynolds number result
Cool analysis log
Circuit heat removal efficiency result
Circuit heat flux
Circuit pressure result
Criteria for assessing cooling performance
Flow front temperature, mold-cavity result
Flux, part (top) result
Flux, part (bottom) result
Flux, part result
Frozen layer percentage, part (bottom) result
Frozen layer percentage, part (top) result
Improper part-mold contact
Maximum temperature position, part result
Mold-melt temperature difference (bottom), part result
Mold-melt temperature difference (top), part result
Mold-melt temperature difference result
Mold parting surface result
Percentage frozen layer, cold runner result
Percentage frozen layer result
Percentage molten layer result
Rapid heating and cooling circuit density result
Rapid heating and cooling circuit flow rate result
Rapid heating and cooling circuit pressure result
Rapid heating and cooling circuit Reynolds number result
Steam condensate mass result
Steam quality result
Temperature at surface, cold runner result
Temperature at surface, hot runner result
Temperature, circuit coolant (averaged) result
Temperature, circuit coolant (transient) result
Temperature, circuit coolant (transient from start-up) result
Temperature, core (averaged) result
Temperature, core (transient) result
Temperature, core (transient from start-up) result
Temperature difference, insert result
Temperature difference, part result
Temperature difference, parting plane result
Temperature, insert (bottom) result
Temperature, insert (top) result
Temperature, internal mold result
Temperature, maximum, cold runner
Temperature, maximum, part result
Temperature, mold (bottom) result
Temperature, mold (top) result
Temperature, mold (averaged) result
Temperature, mold (transient) result
Temperature, mold (transient from start-up) result
Temperature, mold boundary result
Temperature, mold-cavity interface (averaged) result
Temperature, mold-cavity interface (transient) result
Temperature, mold-cavity interface (transient from start-up) result
Temperature, mold-circuit interface (averaged) result
Temperature, mold-circuit interface (transient) result
Temperature, mold-circuit interface (transient from start-up) result
Temperature, mold result
Temperature, mold insert (averaged) result
Temperature, mold insert (transient) result
Temperature, mold insert (transient from start-up) result
Temperature, mold-insert difference (averaged) result
Temperature, mold-insert difference (transient) result
Temperature, mold-insert difference (transient from start-up) result
Temperature, mold-mold difference (averaged) result
Temperature, mold-mold difference (transient) result
Temperature, mold-mold difference (transient from start-up) result
Temperature, part result
Temperature, part (bottom) result
Temperature, part (top) result
Temperature, part (averaged) result
Temperature, part (average, profile)
Temperature, part (transient) result
Temperature, part (transient, profile) result
Temperature, part (transient from start-up) result
Temperature, part (transient from start-up, profile) result
Temperature, part insert result
Temperature, part insert (averaged) result
Temperature, part insert (transient) result
Temperature, part insert (transient from start-up) result
Temperature, parting plane (bottom) result
Temperature, parting plane (top) result
Temperature profile, cold runner result
Temperature profile, hot runner result
Temperature profile, part result
Temperature, rapid heating and cooling thermocouples (transient from start-up) result
Temperature, rapid heating and cooling thermocouples (transient) result
Temperature residual, exterior shell result
Temperature residual, inserts result
Temperature residual, part result
Temperature, runner (averaged) result
Temperature, runner (average, profile) result
Temperature, runner (transient) result
Temperature, runner (transient, profile) result
Temperature, runner (transient from start-up) result
Temperature, runner (transient from start-up, profile) result
Time to reach ejection temperature, cold runner result
Time to reach ejection temperature, part result
Time to reach ejection temperature, part (profile) result
Fiber Orientation analysis results
Flow results
Gas-assisted Fill+Pack analysis results
Gate Location analysis results
Injection-compression analysis results
Microcellular Injection Molding analysis results
Microchip Encapsulation analysis results
Molding Window analysis results
Optimization product results
Process Optimization analysis results
Reactive Molding analysis results
Runner Balance analysis results
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797 views,  1 edit(s),  3216 characters(s) Page last modified 16:59, 5 Jun 2012 by contentconnector
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Temperature, mold-cavity interface (transient) result

    Using this result

    Use this result to monitor the temperature of the mold as it is affected by the temperature of the plastic in the cavity during the injection cycle. This result enables you to decide whether the cooling channels are cooling effectively, and whether their placement will affect cycle time and part warpage. If there are hot or cool spots, you may need to adjust the cooling channels, or coolant temperature. Cooling channel placement and the thermal conductivity of the mold will affect the temperature variations.

    TipYou can create an XY plot of the transient mold-cavity interface temperature, on any given node, to see how the temperature at that node varies with time. Click on Results in the Results pane of the Home tab, then click (New Plot File:Simulation_Moldflow/enu/2013/Help/Insight_360/4443-Results4443/4694-Object_M4694/4750-Temperat4750/ac.menuaro.gif Plot) and scroll down to the result. Remember to change the Plot type to XY plot.

    Things to look for

    When viewing the Temperature, mold-cavity interface (transient) result, watch for the following.

    • Localized hot or cold spots.
    • The cooling pattern. Is it evenly distributed?

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