Product help with community knowledge
2013
Simulation Moldflow
HomeSimulation MoldflowEnglish2013HelpInsight 360ResultsMicrochip Encapsulation analysis resultsMaximum wire sweep index - Wire number: XY Plot result

Simulation Moldflow

2012
2013
Help
Installation and Licensing
Insight
Insight 360
Autodesk Simulation Moldflow Insight 360 Help
Tutorials
Getting Started
User Interface
Import and Export
Modeling
The mesh
Molding processes
Analysis sequence
Materials and databases
Process settings
Optimization
Running an analysis
Results
Results (Procedure)
Analysis log
Results files
Criteria files
Valid comparisons
File extensions
Customize results
Object Missing
Result plots
Create New Plot dialog-Result Selection tab
Available results
Plot type
Open a new window
Create New Plot dialog-Result Selection tab
Available results
Plot type
Open a new window
Material
Cut axis
Cut position
Plot properties dialog-Animation tab
Number of frames
Single dataset animation
Scale factor
Overlay with undeformed part
Plot properties dialog-Highlight tab
Line color
Plot properties dialog-Mesh Display tab
Edge display on undeformed part
Edge display on deformed part
Surface display
Plot properties dialog-Methods tab
Selection
Contour
Plot properties dialog-Optional Settings tab
Color
Plot properties dialog-Part Display tab
Edge display on undeformed part
Edge display on deformed part
Surface display
Plot properties dialog-Path Plot tab
X Axis
Scale factor
Overlay with color plot
Plot properties dialog-Scaling tab
All frames
Per frame
Specified
Min.
Max.
Extended color
Plot properties dialog-Tensor tab
Tensor principal values
Principal value
Tensor components
Components
Coordinate system
Glyph axis length ratio
Plot properties dialog-Vector tab
Color
Dart/segment length
Reference coordinate system
Plot properties dialog-XY Plot Properties (1) tab
Independent Variable
Features
Legend position and size
Curves
Plot properties dialog-XY Plot Properties (2) tab
X range
Y range
Show fixed independent variables
Plot title
X axis title
Y axis title
Co-injection analysis results
Object Missing
Fiber Orientation analysis results
Flow results
Gas-assisted Fill+Pack analysis results
Gate Location analysis results
Injection-compression analysis results
Microcellular Injection Molding analysis results
Microchip Encapsulation analysis results
Deflection, in-plane (wire sweep) result
Microchip Encapsulation analysis log
Pressure difference (paddle shift) result
Pressure difference, maximum (paddle shift) result
Wire-sweep index result
XY deflection (wire sweep) result
Wire number result
Maximum wire deflection magnitude - Wire number: XY Plot result
Maximum wire sweep index - Wire number: XY Plot result
Wire pairs within critical clearance result
Distance to closest wire result
Molding Window analysis results
Optimization product results
Process Optimization analysis results
Reactive Molding analysis results
Runner Balance analysis results
Shrink analysis results
Stress analysis results
Underfill Encapsulation analysis results
Warp analysis results
Birefringence analysis results
Crystallization analysis results
Reports
Reference materials
Troubleshooting guide
Application Programming Interface (API)
Glossary of Terms
Adviser
Communicator
Simulation TV
Videos
Community

Community Scoring

Was this page helpful?

Tag Tags0

This page has no tags

Page statistics

795 views,  1 edit(s),  4489 characters(s) Page last modified 17:04, 5 Jun 2012 by contentconnector
How to add your knowledge

Maximum wire sweep index - Wire number: XY Plot result

    Table of contents
    1. 1. Using this result

    The Maximum wire sweep index - Wire number: XY Plot result is generated by a 3D Microchip Encapsulation analysis when the selected analysis sequence includes Wire Sweep.

    The single maximum value of the wire sweep index predicted for each wire is plotted versus the wire number.

    Using this result

    Use this information to identify individual wires that undergo the greatest drag force during cavity filling.

    NoteIn order to calculate the Maximum wire sweep index - Wire number: XY Plot result, the wire sweep calculation must be performed in Autodesk Simulation Moldflow Insight.
    TipThis option is set on the Microchip Options tab of the Reactive Molding solver parameters (3D) dialog. Double-click Process Settings in the Study Tasks pane, or click (Home tab File:Simulation_Moldflow/enu/2013/Help/Insight_360/4443-Results4443/4912-Microchi4912/4921-Maximum_4921/ac.menuaro.gif Molding Process Setup panel File:Simulation_Moldflow/enu/2013/Help/Insight_360/4443-Results4443/4912-Microchi4912/4921-Maximum_4921/ac.menuaro.gif Process Settings) to open the Process Settings Wizard. Click Next to display the Profile Settings page; click Advanced options; click Edit in the Solver parameters area; and click the Microchip Options tab. Set the Perform wire sweep/paddle shift simulation in option to Autodesk Simulation Moldflow Insight.

    Comments0

    Attach Files

    Files1

    FileSizeDateAttached by 
     ac.menuaro.gif
    No description
    		63 bytes17:04, 5 Jun 2012contentconnectorActions
    Powered by MindTouch
    © Copyright 2013 Autodesk, Inc. All rights reserved.   Privacy Policy — Legal Notices & Trademarks