The Maximum wire sweep index - Wire number: XY Plot result is generated by a 3D Microchip Encapsulation analysis when the selected analysis sequence includes Wire Sweep.
The single maximum value of the wire sweep index predicted for each wire is plotted versus the wire number.
Using this result
Use this information to identify individual wires that undergo the greatest drag force during cavity filling.
In order to calculate the Maximum wire sweep index - Wire number: XY Plot
result, the wire sweep calculation must be performed in Autodesk Simulation Moldflow Insight
This option is set on the Microchip Options
tab of the Reactive Molding solver parameters (3D)
in the Study Tasks pane, or click
( ) to open the Process Settings Wizard
. Click to display the Profile Settings
page; click ; click in the Solver parameters
area; and click the Microchip Options
tab. Set the option to Autodesk Simulation Moldflow Insight