The Wire pairs within critical clearance result is generated by a 3D Microchip Encapsulation analysis when the selected analysis sequence includes Wire Sweep.
The plot shows the number and location of wire pairs for which predicted clearance between the wires is within the critical clearance.
NoteThe value is specified in the solver parameters. The default value is zero, indicating that the surfaces of adjacent wires can touch.
Using this result
Use this information to identify pairs of wires that are too close together after wire deformation occurs during cavity filling.
In order to calculate the Wire pairs within critical clearance
result, the wire sweep calculation must be performed in Autodesk Simulation Moldflow Insight
This option is set on the Microchip Options
tab of the Reactive Molding solver parameters (3D)
in the Study Tasks pane, or click
( ) to open the Process Settings Wizard
. Click to display the Profile Settings
page; click ; click in the Solver parameters
area; and click the Microchip Options
tab. Set the option to Autodesk Simulation Moldflow Insight