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Wire pairs within critical clearance result
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Wire pairs within critical clearance result

    Table of contents
    1. 1. Using this result

    The Wire pairs within critical clearance result is generated by a 3D Microchip Encapsulation analysis when the selected analysis sequence includes Wire Sweep.

    The plot shows the number and location of wire pairs for which predicted clearance between the wires is within the critical clearance.

    NoteThe Critical clearance between wires value is specified in the solver parameters. The default value is zero, indicating that the surfaces of adjacent wires can touch.

    Using this result

    Use this information to identify pairs of wires that are too close together after wire deformation occurs during cavity filling.

    NoteIn order to calculate the Wire pairs within critical clearance result, the wire sweep calculation must be performed in Autodesk Simulation Moldflow Insight.
    TipThis option is set on the Microchip Options tab of the Reactive Molding solver parameters (3D) dialog. Double-click Process Settings in the Study Tasks pane, or click (Home tab File:Simulation_Moldflow/enu/2013/Help/Insight_360/4443-Results4443/4912-Microchi4912/4922-Wire_pai4922/ac.menuaro.gif Molding Process Setup panel File:Simulation_Moldflow/enu/2013/Help/Insight_360/4443-Results4443/4912-Microchi4912/4922-Wire_pai4922/ac.menuaro.gif Process Settings) to open the Process Settings Wizard. Click Next to display the Profile Settings page; click Advanced options; click Edit in the Solver parameters area; and click the Microchip Options tab. Set the Perform wire sweep/paddle shift simulation in option to Autodesk Simulation Moldflow Insight.

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