Stress analysis results

Topics in this section

• Stress in first principal direction result

  The Stress in first principal direction result shows the first principal stress (maximum normal stress) in the part (Warp or Stress analysis), or in the wire or paddle (Microchip Encapsulation analysis), at the selected position through the cross-section, after ejection.

• Stress in second principal direction result

  The Stress in second principal direction result shows the second principal stress in the part (Warp or Stress analysis), or in the wire or paddle (Microchip Encapsulation analysis), at the selected layer through the cross-section, after ejection.

• Stress, Mises-Hencky result

  The Stress, Mises-Hencky result shows the Mises-Hencky stress (maximum normal stress) in the part (Warp or Stress analysis), or in the wire or paddle (Microchip Encapsulation analysis), at the selected layer through the cross-section, in the deformed state after ejection has occurred.

• Von-Mises stress, core result

  The von-Mises stress, core result shows the von-Mises stress in the core at ejection.

• Von-Mises stress, maximum result

  The von-Mises stress, maximum result shows the maximum von-Mises stress in the part at ejection.

• Stress, Normal to Core result

  The Stress, Normal to Core result shows the value most cavity pressure sensors report as the "cavity pressure". While the polymer is molten the stress value is very close to the cavity pressure but when the polymer is frozen and the mold (core) has a significant elastic deformation then the value may be significantly different from the pressure result.

• Derivation of stress results

  For a Midplane Stress or Warp analysis, the Stress Settings or Warp Settings page of the Process Settings Wizard includes an option to select which types of stress results to output.