Simulation Moldflow

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795 views1 edit(s)2437 characters(s) Page last modified 17:06, 5 Jun 2012 by contentconnector
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Underfill encapsulation analysis log

    There is a separate table for the filling phase, and for the curing phase of the analysis.

    This text report generated by the Underfill Encapsulation analysis.

    Using the analysis log

    The analysis log for an Underfill Encapsulation analysis can be used to determine whether the part filled completely during injection before the curing phase began.

    Look at the analysis progress table for the injection phase and check whether 100% of the cavity volume filled. If this did not occur, then you may see a message stating that the maximum machine injection pressure was reached and a short shot occurred.

    Things to look for

    Short shot
    If this problem occurs, try changing the following process settings.
    1. Initial encapsulant temperature,
    2. Substrate temperature.